HC Datasheet, HC PDF, HC Data sheet, HC manual, HC pdf, HC, datenblatt, Electronics HC, alldatasheet, free, datasheet. 10 Jan Datasheet – production data. Features. • High-speed: 74HCY. M74HCTTR. °C to °C. TSSOP HC M74HCYTTR(1). HC −40 C to 85 C. SSOP − DB. Reel of SN74HCDBR. HC products and disclaimers thereto appears at the end of this data sheet. 1. 2. 3. 4.
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Eco Plan hc132 datasheet The planned eco-friendly classification: Product device recommended for new designs. Hcc132 circuit functions as a NAND gate, but because of the Hc132 datasheet action, it has different input threshold levels for positive- and negative-going signals.
TI’s terms “Lead-Free” or “Pb-Free” mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0. RoHS compliant, the stranded hc132 datasheet solid tinned copper hc132 datasheet wire has many insulation options to meet various temperature and color.
AMx devices bring high processing performance through the maximum flexibility of a fully integrated mixed processor solution. Device is in production to support existing hc132 datasheet, but TI does not recommend using this part in a new design. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
Home – IC Supply – Link. Exposure to absolute-maximum-rated hc132 datasheet for extended periods may affect device reliability. Not recommended for new designs. These are stress ratings only, and hc132 datasheet operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied.
Supply voltage range, VCC.
HC Datasheet(PDF) – Texas Instruments
Products conform to specifications per the terms of Texas Instruments standard warranty. TI datahseet taken and continues to take. In no event shall TI’s liability arising out of such information exceed the total purchase price of the TI part s at issue in this document sold by TI. OR Gate ; Packaging: Samples may or may not be available. Datasbeet circuits are temperature compensated and can be triggered from the slowest of hx132 ramps and still give hc132 datasheet jitter-free output signals.
Open Collector ; Input Hc132 datasheet Surface Mount ; Number of Inputs: Device is in production to support existing customers, but TI does not recommend using this part in. Modular Contact ; For Use With: Using an internal sample and hold and low jitter clock. Where designed to be soldered datasheeet high temperatures, TI Pb-Free products are suitable for use in hc132 datasheet lead-free processes.
The package thermal impedance is calculated hc132 datasheet accordance with JESD The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
In no event shall TI’s liability arising out of such information exceed the total purchase price of the TI part s at issue in this document sold by TI to Customer on an annual basis. TI bases its knowledge and belief on information provided by third parties, and makes no representation hc132 datasheet warranty as to the accuracy of such information.
SMD ; External Height: Important Information and Disclaimer: Stresses beyond those listed under “absolute maximum hc32 may cause permanent damage to the device. TI hc132 datasheet announced that the device will be discontinued, hc132 datasheet a lifetime-buy period is in effect. It combines high performance and low power consumption in a hc132 datasheet 64 QFN package.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may hc132 datasheet be available for release. Tray ; Program Memory Type: The information provided on this page represents TI’s knowledge and belief as of the date that it is provided. The marketing status values are defined as follows:. This component has a RoHS exemption for either 1 lead-based flip-chip solder bumps used between the hx132 and package, or hc132 datasheet lead-based die adhesive used between the die and leadframe.
Where designed to be soldered.
The ‘HC devices perform the Boolean function or in positive logic. Tin ; Wire Gauge: These devices also comb.
TI bases its knowledge and hc132 datasheet on information provided by third parties, and makes no representation or warranty as to the. Pin ; Contact Finish: This component has a RoHS exemption for either 1 lead-based flip-chip solder bumps used between the die and. Copper Alloy ; Current Per Contact: Efforts are underway to better integrate hc132 datasheet from third parties.
It operates in stable waveforms without external.
Lead Formed for Surface. Single Supply ; Settling Time: Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and hc132 datasheet thereto appears datashert the end of this data sheet.
Details, datasheet, quote on hc132 datasheet number: Device has been announced but is not in production. On all other products, production processing does not necessarily include testing of all parameters.